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Copper Nickel Sputtering Target CuNi Target Cu Alloy for STN, TP, TFT

Copper Nickel Sputtering Target CuNi Target Cu Alloy for STN, TP, TFT

Copper nickel alloy target is of silver white metallic luster, melting point: 1350℃, density: 8.85g/cm3, purity: 99.5%-99.995%. It is manufactured through vacuum sintering furnace, hot isostatic pressing, thermal mechanical treatment and precision mechanical processing. Now, it is widely used...

Product Details

Copper nickel alloy target is of silver white metallic luster, melting point: 1350℃, density: 8.85g/cm3, purity: 99.5%-99.995%. It is manufactured through vacuum sintering furnace, hot isostatic pressing, thermal mechanical treatment and precision mechanical processing. Now, it is widely used for PE, STN, Ai, TFT, TP, LCD, vehicle navigation, glass, semiconductor and other magnetron sputtering coating.


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