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Plane Sputtering Target

  • Silicon Dioxide Sputtering Target SiO2 Target for Optical Glass

    Silicon Dioxide Sputtering Target SiO2 Target for Optical Glass

    Silicon dioxide target is white transparent, CAS number: 14808-60-7, melting point: 1650℃, density: 2.2g/cm3, purity: >99.99%. It is widely used in magnetron sputtering coating for communication fiber, medicine, STN, Ai, TFT, TP, LCD, vehicle navigation, glass, semiconductor, etc..Read More

  • Boron Sputtering Target B Target for Semiconductor

    Boron Sputtering Target B Target for Semiconductor

    Boron target is of gray metal luster, melting point: 2075℃, density: 2.34g/cm3, purity: 99.9%-99.99%. It is manufactured through vacuum sintering furnace, hot isostatic pressing, precision mechanical processing, etc.. It is mainly used in magnetron sputtering coating for STN, Ai, TFT, TP, LCD,...Read More

  • Aluminum Oxide Sputtering Target Al2O3 Target for Optical Glass

    Aluminum Oxide Sputtering Target Al2O3 Target for Optical Glass

    Alumina target is of white luster, molecular weight: 101.96, density 3.97 g/cm3, melting point 2040℃, boiling point: 5500℃, purity: 99.99% and 99.999%. It is manufactured through hot pressing and precision machining. It is mainly for antireflection film, multilayer interference film, protective...Read More

  • Tin Oxide Sputtering Target SnO2 Target for STN

    Tin Oxide Sputtering Target SnO2 Target for STN

    Stannic oxide target is of light yellow, melting point: 1630℃, density: 6.95g/cm3, purity: 99.6%-99.99%. It is manufactured through vacuum sintering furnace, hot isostatic pressing, thermal mechanical treatment and precision machining. It is mainly used in magnetron sputtering coating for...Read More

  • Titanium Sputtering Target Ti Target Coating for Automotive Glass

    Titanium Sputtering Target Ti Target Coating for Automotive Glass

    Titanium target is of silvery metal luster, melting point: 1668℃, density: 4.5g/cm3, purity: 99.5%-99.999%. It is manufactured through vacuum sintering furnace, hot isostatic pressing, heat treatment and precision machining. It is mainly in magnetron sputtering for STN, Ai, TFT, TP, LCD, vehicle...Read More

  • Aluminum Silicon Sputtering Target AlSi Target for Architectural Glass

    Aluminum Silicon Sputtering Target AlSi Target for Architectural Glass

    Silicon- aluminium alloy is of gray metallic luster as metallic base thermal material. High silicon-aluminum alloy material can maintain the excellent properties of silicon and aluminum, and the content of silicon and aluminium is very rich. The silicon powder technology is mature and cheap...Read More

  • Molybdenum Sputtering Target Mo Target Length Up to 2000mm for STN, TP and TFT

    Molybdenum Sputtering Target Mo Target Length Up to 2000mm for STN, TP and TFT

    Molybdenum target’s density is 10.2 g / cm3, melting point: 2610℃, boiling point: 5560℃, purity: 99.9% ~99.99%. It is manufactured through sintering, slicing, grinding etc.. It is widely used in industries like conductive glass, STN/TN/TFT-LCD, optical glass, ion plating etc..Read More

  • Zinc Sputtering Target Zn Target Purity 4N5 for STN, TP and TFT

    Zinc Sputtering Target Zn Target Purity 4N5 for STN, TP and TFT

    Zinc target is silvery with some bluish gray gold, atomic weight: 65.38, melting point: 419.5℃, boiling point: 907℃, dense degree: 7.14g/cm3. It is mainly used for semi-infrared laser film material, wide band gap semiconductor materials etc..Read More

  • Niobium Sputtering Target Ni Target Purity 4N for STN, TP and TFT

    Niobium Sputtering Target Ni Target Purity 4N for STN, TP and TFT

    Niobium target is of gray metallic luster, melting point: 2468℃, boiling point: 4742℃, density: 8.57g/cm3, purity: 99.95%. It is manufactured through sintering furnace, hot isostatic pressing, thermal mechanical treatment and precision machining. It’s currently widely used in magnetron...Read More

  • Carbon Sputtering Target C Target Purity 3N-5N for STN, TP and TFT

    Carbon Sputtering Target C Target Purity 3N-5N for STN, TP and TFT

    Carbon target, CAS:7782-42-5, is of gray metallic luster, in shape of ring flake, wafer, melting point: 3550℃, density: 2.27g/cm3, purity: 99.9%-99.999%. It mainly manufactured through vacuum sintering furnace, hot isostatic pressing, precision machining. It’s is widely used in magnetron...Read More

  • Cerium Sputtering Target Ce Target Purity 3N-5N for STN, TP and TFT

    Cerium Sputtering Target Ce Target Purity 3N-5N for STN, TP and TFT

    Cerium target is of gray metal luster, melting point: 798℃, density: 6.78g/cm3, purity: 99%-99.999%. It is manufactured through vacuum sintering furnace, hot isostatic pressing, thermal mechanical treatment and precision machining. At present, it is widely used in polishing materials, catalysts,...Read More

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